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Intel names SeokHee Lee EVP to lead foundry advanced packaging and back-end manufacturing

Intel has appointed former SK Hynix CEO SeokHee Lee as an executive vice president in its foundry unit, putting him in charge of advanced packaging and back-end manufacturing. The move follows President Donald Trump’s announcement that Apple agreed to work with Intel to design and manufacture chips in the U.S., and comes after Tesla confirmed it will use Intel’s 14A process. Intel is accelerating its 14A roadmap, which is expected to enter mass production in 2029, alongside its 18A technology as it seeks to revive its foundry business.
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