Samsung Electronics Taps TSMC's 3nm Process for NVHBM Base Dies at Nvidia's Request
AI Market Summary
Nvidia steering Samsung to TSMC 3nm for NVHBM base dies signals that next-gen HBM stacks increasingly depend on leading-edge foundry capacity, strengthening TSMC's strategic position in the AI supply chain. It also flags capacity constraints, with Samsung weighing in-house production as a fallback. The read-through is constructive for TSMC and advanced-node equipment demand, reinforcing AI-driven semiconductor capex momentum.
Impact level
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Samsung Electronics has decided to use TSMC's 3nm process to make NVHBM base dies at Nvidia's request. The company is also evaluating whether it could produce the base dies in-house using its own foundry lines if NVHBM demand exceeds TSMC's capacity. The decision highlights the growing dependence of high-performance memory chips on advanced process nodes.
